The Register bericht dat Rambus Inc. op een Rambus conferentie in Japan een nieuwe packaging technologie heeft aangekondigd waarmee de 'verpakkingskosten' van een Rambus module met 50% verlaagd kunnen worden. Da's alvast een stap in de goede richting:
The packaging in Rambus RIMM modules, which includes an expensive spreader, is one reason why the memory has been so expensive in the past, as Peter McWilliams, an Intel Fellow, explained to us at the Intel Developer Forum last month.Now Tessera, a supplier of packaging technology, has come to Rambus' rescue, by introducing a technology which will sharply cut the costs of packaging for the very pricey RIMMs.
The process, known as Zinger 4, cuts the packaging costs of RIMMs by over 50 per cent, Tessera claims. That, in combination with other cost cutting methods Rambus is adopting, will further reduce the cost of the still very pricey modules.
If Rambus drops its royalties, as it broadly hinted it might do, that will further help to reduce costs.