Taiwan Semiconductor Manufacturing, de grootste chip foundry ter wereld, heeft aangekondigd dat het bedrijf is begonnen met de volume productie van de GeForce3. Dit betekent dat videokaart fabrikanten op korte termijn de productie van GeForce3 kaarten kunnen opschroeven, waardoor de prijzen van deze kaartjes tot een iets aantrekkelijker niveau - voor zover je daarvan uberhaupt kunt spreken bij de GeForce3 - zullen dalen.
TSMC maakt bij de productie van de GeForce3 gebruik van een nieuw state-of-the-art 0,15micron productieprocédé dat de inspirerende naam CL015LV toebedeeld heeft gekregen. nVidia behoort tot de eerste bedrijven die gebruik maken van dit nieuwe procédé. Ook de X-Box GPU en de X-Box Media Communications Processor worden met de CL015LV technologie geproduceerd:
Taiwan Semiconductor Manufacturing Company (NYSE: TSM), the world’s largest dedicated semiconductor foundry, today announced that it has successfully ramped the foundry industry leading 0.15µm process to full production status. TSMC has delivered the highly-anticipated GeForce3 GPU, in addition to the key processors for the Xbox™ video game console, to NVIDIA Corporation (Nasdaq: NVDA) using the high-performance version of TSMC’s 0.15µm process (CL015LV). Several other customer products, using diverse 0.15µm process variations, are also in volume production stage.
[...] TSMC’s 0.15µm process targets leading-edge computer, communications, and consumer applications for high speed and low power consumption. The process provides significant performance advantages over 0.18µm processes while, at the same time, significantly reducing die cost.
[...] NVIDIA Corporation, a global leader in advanced graphics and multimedia processing technology, is among the first companies to implement 0.15µm designs for the superior performance. NVIDIA has used this new process for the recently announced GeForce3 GPU, the Xbox Graphics Processing Unit (XGPU) and Xbox Media Communications Processor (MCPX).
TSMC’s 0.15µm process is an important platform that meets the market demand for an optimal combination of speed, power and density while accommodating a robust transition from aluminum to copper interconnects. TSMC was the first foundry to deliver the 0.15µm process technology, which was qualified in March 2000. The technology has been transferred to TSMC fabs, with ample capacity to meet growing customer demand.
The 0.15µm process will be a major focus at TSMC’s Technology Symposiums, which will be held on April 23rd in San Jose, Calif.; April 25th in Austin, Tex.; April 27th in Boston, Mass.; and April 30th in Costa Mesa, Calif. To register for any Symposium, go to www.tsmc.com and click on the Technology Symposium registration button.
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