Bij Digit-Life staat een interview met VIA Technologies. In het verhaal worden veel verschillende onderwerpen aangesneden, maar veel interessante nieuwtjes staan er helaas niet in. Hieronder heb je toch alvast een 4-tal vragen, de rest kun je hier nalezen.
USB 2.0 specification is ready and USB 2.0 devices will probably appear on the market by Christmas. The first samples of VIA VT8235 South bridge with USB 2.0 support will be available only in Q2’2001 and the situation is the same with chipsets from other companies. Why do we have such a long time gap?
Some time must pass until the mature USB 2.0 devices are developed. Next Christmas will be the time for USB 2.0.
Will S3 Graphics develop stand-alone graphics chips?
Yes, VIA-S3 Joint Venture will develop both stand-alone and integrated graphics chips.
Apollo Pro266 and KT266 will be launched at the same time but there will be almost one-quarter time gap between PM266 and KM266 release. Are there any problems with integrating S3 graphics core into the chipset with EV6 support? Or maybe chipsets for Intel CPUs are the first priority for VIA?
There are no technical difficulties in delivering this solution. Apart from the reason which I mentioned answering the previous question, there is also another one. Taking into account that we are unable to design both chipsets at once, VIA decided to release the chipset supporting our own processor – VIA Cyrix III – first.
When can we expect the transition to the faster DDR SDRAM? What speed will PC2600 and PC3200 have?
Hopefully DDR II will be announced at the beginning of 2002. So we will see the first DDR II systems during the second half of 2002. The year 2003 will be the year of DDR II. The specification for this standard has not been finalized yet. JEDEC, memory vendors and the whole industry are still reviewing the specification. It is too early to talk about details.