VIA en TSMC hebben vandaag een press release de wereld ingebracht waarin ze aankondigen te zijn gestart met het in gebruik nemen van 0,13 micron technologie. Het Taiwanese Semiconductor Manufacturing Company heeft reeds de eerste 0,13 micron wafers afgeleverd bij de chipbakker die deze gebruikt om nieuwe Cyrixen van te bakken:
Taiwan Semiconductor Manufacturing Company (NYSE: TSM) and VIA Technologies, Inc. today announced the delivery of the foundry industry’s first 0.13-micron functioning wafers. At the same time, VIA Technologies, Inc., one of the world’s leading fabless semiconductor design houses, announced that the next generation of VIA Cyrix processors utilized this new industry-leading process.
The new VIA Cyrix ® processors were developed using TSMC’s 0.13-micron CL013LV process, which features the foundry industry’s most advanced technology for high-performance, high-density designs. The process will significantly enhance both the performance and power efficiency of VIA Cyrix processor designs, according to VIA officials. TSMC’s complete 0.13-micron process technology family includes core (CL013G), low power (CL013LP) and high-performance (CL013LV) choices, all of which are available today.
[...] VIA has already received its 0.13-micron wafers and verified their functionality. The new VIA Cyrix ® processors are expected to meet the specific needs of the value PC, notebook and information appliance (IA) markets.
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