De mannan van Sharky Extreme hebben een mooie Intel CPU en Chipset roadmap in elkaar geknutseld. In het artikel komen alle belangrijke producten langs die we van Intel mogen verwachten de komende tijd zoals de Pentium 4, de 0.13 micron Pentium 3, de 100MHz Celeron II, de Timna en een aantal chipsets. Een goed stukje leesvoer dus als je niet precies op de hoogte bent van Intel's plannen. Hieronder een stukje over de voor- en nadelen van een 0.13 micron productieproces:
Intel will be moving their high-end processors to a .13 micron process. As usual, using a smaller process provides many advantages. First, it saves money by allowing more processors to be built with one silicon wafer. Second, it saves power and reduces heat by decreasing the power needed per gate per clock. And third, it allows higher clock speeds because smaller gates can switch faster.
The disadvantage of a smaller process is that it increased the heat density of the processor. When more gates are squeezed into less space and the clock speed is turned up, a tremendous amount of heat is produced across a tiny surface area. Because of the increased heat density of .13 micron, Intel will be doing two things.
First, they will integrate a heat spreader into the processor package. This heat spreader will provide a wider contact patch for whatever heat sink is used. This lessens the danger of CPU failure due to an improperly installed or designed heat sink.
Second, they are calling for more advanced heat sink designs. At IDF, Intel was showing a copper-based heat sink with aluminum fins, weighing in at a hefty 450g. This massive heat sink is the reason for the redesigned case for the Pentium 4 mentioned above. As clock speeds increase, transistor count rises, and die sizes shrink, you can expect more exotic cooling methods in the future.
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