Silicon Strategies meldt ons dat Philips Electronics en Samsung Electronics samen een joint venture hebben gevormd met het Chinese Datang Mobile Communications Equipment. Beijing T3G Technology, zoals de joint venture gaat heten, heeft als doel chips te ontwerpen voor derde generatie TD-SCDMA mobiele netwerken. Time Division - Synchronous Code Division Multiple Access is één van de drie 3G specificaties die zijn geaccepteerd door de ITU (International Telecommunications Union) en wordt op dit moment in China geïmplementeerd:
The strength of TD-SCDMA technology and its family is its ability to offer network operators a progressive and seamless transformation from the existing 2G network towards one capable of delivering 3G services reusing existing transmission links. Advanced features such as code division multiple access, smart antennae, mutual synchronization between mobile and base stations and joint detection, all of which can now be physically realized using advanced silicon processes, allow the efficiency of spectrum usage to be three to five times higher than that of conventional GSM.