chaos schrijft: "AMD heeft hun embedded processor-lijn uitgebreid met de K6-2E 350 en 400. De K6-2E is speciaal voor gebruik in terminals, printer controllers, communicatie etc.":
SUNNYVALE, CA--January 19, 2000--AMD today introduced two new AMD-K6™-2E embedded processors, providing higher-performing solutions to help meet the increasing bandwidth demands of the embedded market. The 400MHz standard-power processor and the 350MHz low-power processor extend the performance of the AMD-K6-2E family of processors and are AMD's highest frequency embedded processors offered to date.The AMD-K6-2E family of embedded processors is designed to offer compelling yet affordable power and performance for embedded applications, including point-of-sale terminals, printer controllers, public and private communications infrastructure, industrial automation, information appliances, and Microsoft® Windows® operating system-based single board computers and embedded PCs.
[...] The 350MHz low-power version of the AMD-K6-2E processor runs at a reduced core voltage of 1.9V to provide a maximum power consumption of 11 Watts and extended temperature rating of 85ºC, while the 400MHz standard power version is the embedded equivalent to the popular desktop AMD-K6-2 processor with a standard 2.2V core voltage and temperature rating. On both versions, the I/O voltage operates at the industry-standard 3.3V level.
Designed to run both 16-bit and 32-bit software, the AMD-K6-2E processor delivers high-performance x86 instruction set processing and is compatible with the Microsoft Windows CE, Windows 98, Windows NT® and Windows NTE operating systems, as well as applications that run on them, including the latest software optimized for 3DNow!™ and MMX™ technologies. The AMD-K6-2E processor also is supported by other leading PC and x86 compatible operating systems, including numerous Real Time Operating Systems (RTOS) commonly used in embedded applications, such as pSOS, QNX, RTXC and VxWorks.
The 9.3-million-transistor AMD-K6-2E processor is manufactured on AMD's 0.25-micron, five-layer-metal process technology using local interconnect and shallow-trench isolation at AMD's Fab 25 wafer fabrication facility in Austin, Texas. The AMD-K6-2E processor is packaged in a Socket 7 and Super7™ platform-compatible, 321-pin ceramic pin grid array (CPGA) package using C4 flip-chip interconnection technology.
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