Om ontwikkeling en gebruik van 'lood-vrije' behuizingen (packages) en technieken bij de produktie van halfgeleider-producten te bevorderen, hebben Infineon Technologies, Philips Semiconductors en STMicroelectronics een voorstel gepubliceerd, met daarin definities en normeringen voor een standaard op dit gebied. De drie bedrijven zijn hun samenwerking op dit terrein begonnen in 2001, zo valt in het persbericht te lezen bij STMicroelectronics. Lood komt voor in soldeerverbindingen, maar ook in halfgeleider-behuizingen. Eerdere pogingen van bedrijven om lood-vrij te gaan werken mislukten, wegens het ontbreken van internationale standaards en methodes, die de kwaliteit en betrouwbaarheid van loodvrije technieken konden waarborgen. De zorg voor het milieu bij deze chip-bakkers komt niet zomaar uit de lucht vallen. De Europese Commissie heeft besloten dat vanaf januari 2006 lood, kwik, cadmium en andere zware metalen, niet meer in elektronische komponenten aanwezig mogen zijn:
"Many different kinds of 'lead-free' solder alloys and soldering processes are being investigated or developed around the world, using multiple combinations of elements like tin, silver, copper, bismuth, indium and zinc, all of which require increased temperature profiles relative to the well known tin-lead alloys during the soldering process," said Carlo Cognetti, Vice President for New Package Development at STMicroelectronics. "To accelerate the transition to 'lead-free' technology, the electronics industry needs a common approach to quantifying solderability, heat resistance and other issues that affect reliability."
"At present, there is not even an internationally agreed definition of the maximum amount of lead that can be allowed in a 'lead-free' component or process," said Dr. Wolfgang Bloch, Head of Environment Protection and Safety Management at Infineon Technologies. "The market is confused because there are no rules or standards so far for evaluating alternative technologies. What we are doing is proposing some key ground rules that will help accelerate progress. Our initiative shows the inevitable transition to 'green' assembly on a global scale."
"Europe has taken the lead in proposing the world's first legislation to eliminate lead from electronic equipment and components," said Leo Klerks, Environmental Officer at Philips Semiconductors. "Our three companies' interest in using lead-free soldering technologies has partly been fuelled by legislative restrictions from the European Commission. Effective from 1 January 2006, materials such as lead, mercury, cadmium and others will be forbidden in electrical and electronic devices. By sharing our knowledge and enthusiasm, Europe's leading semiconductor manufacturers can make huge steps towards meeting this goal."
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