Dean Kent van Real World Technologies heeft op het message board van Ace's Hardware een posting geplaatst met info over de vermeende bug in de AMD 760 chipset. Volgens Dean kampt de laatste revisie van de 760 chipset met warmte problemen, waardoor deze chips een betere koeling vereisen. In de nieuwste revisie, die vanaf maandag wordt verscheept, is het probleem verholpen. Een aantal mobofabrikanten, waaronder Gigabyte, Epox en FIC, besloten daarop te wachten met de productie van 760 borden:
The new revision of the chipset was supposed to be completed this week, and manufacturers were supposed to get the new revision on Monday.Some manufacturers are shipping boards based upon the last revision, which has some heat issues requiring massive heatsinks. This has supposedly been corrected in the new revision, so there are other manufacturers who have decided to wait.
This, I believe, is what caused the confusion on the part of the reporter from The Register. Gigabyte apparently was the one who reported the heat problem, and decided to wait. EPoX also decided to wait. I believe FIC decided to wait also. They all are aware of the heat problem, but consider it 'old news' because it was reported and fixed already...
Regards,
Dean Kent
Real World Technologies