Ik lees bij AMD Zone dat AMD de K6-2E+ en K6-IIIE+ embedded processors heeft geïntroduceerd. Beide types maken gebruik van een 0.18micron procédé en zijn per direct leverbaar in standaard 2.0V en low power versies met PowerNow! technologie. De K6-2E+ komt in versies van 350, 400 en 450MHz, de K6-IIIE+ gaat tot en met 550MHz. Meer info vind je in deze press release, waarvan hieronder een paar quotes:
AMD today introduced two new embedded processors offering an exceptional blend of high performance and efficient power consumption for embedded applications, including set top boxes, tethered Internet access devices, server appliances, thin-client PCs, point-of-sale terminals and telecommunications equipment. The new AMD-K6(tm)-2E+ and AMD-K6-IIIE+ embedded processors, based on AMD's 0.18 micron process technology, extend the range of Socket 7 and Super7(tm) compatible embedded processors to new levels of performance. The standard power AMD-K6-2E+ embedded processor is available at speed grades of 400, 450 and 500MHz, with a low power version available at frequencies of 350, 400 and 450MHz. AMD is also introducing the standard power AMD-K6-IIIE+ processor at 400, 450, 500 and 550MHz, with a low power version available at 400, 450 and 500MHz. All of AMD's new processors are available in 321-pin grid array (PGA) packaging. Selected versions of the embedded processors also are planned to be available in AMD's new 349-lead organic ball grid array, or OBGA, packaging. All low powered versions of both the AMD-K6-2E+ and AMD-K6-IIIE+ processors feature the innovative AMD PowerNow!(tm) technology, enabling reduced power consumption for power-sensitive applications.
"AMD's new embedded processors are designed to deliver robust and thermally efficient performance available to the embedded market today," said Jerry Vogel, vice president and general manager, Embedded Processor Division at AMD. "They offer the performance, compatibility and stability of supply that AMD customers have come to expect from the E86(tm) family of embedded processors. Lower power and organic BGA packaging address specific needs of embedded system designers."