Ik kwam bij HardOCP ook nog info tegen over verandert socket370 ontwerp van Intel. Ik heb dit allemaal niet gevolgd, maar volgens de mening van een HardOCP lezer zou dit tot gevolg kunnen hebben dat de Celeron van z'n SMP pinnetjes wordt ontdaan:
"If you will look at the attached Intel docs you will see that a "flip chip" design is already in place in the socket 370's, thus putting the silicon at the top of the chip. ( this is classic Intel marketing, advertise existing features as new.) It does replace the lead frame, and provide better noise.. blah blah blah. But. will not change the pin outs, nor will they emerge from the center of the CPU packaging. Even in direct pin out solutions, like these ones, there is still a bonding process which must take place. The " Pins " which come off the die are usually far to small to mount in a socket, I mean these are REALLY tiny. SO they mount in a sort of mini socket so to speak which is bonded to the packaging pins. This means two things, one.... No more SMP with this retool, SMP is sure to get the axe. ( unless Intel keeps it in there to promote low cost high end performance, to steal k7 sales.) two.... yes, your old boards will work, the pin outs will (most likely) not change."