HardOCP kreeg van een lezer een interessante reaktie op het nieuws dat de nieuwe FC-PGA processors van Intel bijzonder gevoelig zijn voor overclocking. Onder bepaalde omstandigheden kan de plastic verpakking van deze chips open barsten. Volgens de post op HardOCP komt dit mogelijk door sterke temperatuursverschillen in het gedeelte van de chip waar zich de L2 cache bevindt:
Most of the cracked flip chips have been breaking on one corner, or on the edge. This roughly corresponds to the location of the cache on the die (according to intels spec sheet, attached). It also seems to be occuring not only on peltier cooled systems, but on passive cooling systems as well.
Initially, the culprit was thought to be thermal stress, generated by peltiers. After seeing most of the reports from people who were using only large heatsinks (alphas, GWs), the suspicion shifted to mechanical stress on the slug.
Latest indications seem to be a combination of the two. The real problem is the fact that the cache and the processor core generate heat at different rates. When you combine this with a very slightly mis-aligned high-stress joint, you seem to get these problems. This problem only seems to be further excerbated by the greater temperature differential generated by peltier cooling. [break] Intel heeft tegenover The Register te kennen gegeven dat zij niet bekend zijn met problemen rond beschadigde FC-PGA chips: [/break] A spokesman for Intel said: "It's important to use the right kind of heatsink with FC-PGA packaging". He said that while heat sinks designed for ceramic socketed microprocessors might look like they would work with the plastic packaged chips, the thickness of heat sinks designed for FC-PGA chips was different.
He added: "We haven't seen any reports of this packaging breaking." Intel worked with its PC customers to design heat sinks specifically tailored to FC-PGA chips, and these were made to exacting specifications, he said.