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From: Andreas Karner - Noctua.at [mailto:email@example.com]
Sent: maandag 19 januari 2009 14:36
Subject: Re: Question about thermal paste NH-U12P SE1366 / Core i7
first of all many thanks for choosing a Noctua product.
You are right, the FAQ entry is a little bit confusing as it originally comes from
the NH-U12P and thus is not completely right for the NH-U12P SE1366.
We will fix this in the next few days but thanks for you pointing that out.
Regarding the thermal paste it is sufficient to place a drop on the heatspreader of
the CPU,install the NH-U12P SE1366 on it and let pressure do the spreading.
We've conducted numerous tests about this topic on the Core i7 platform and found
this method to produce good results.
If you want to ensure slightly better distribution you can also place a larger drop
in the middle of the heatspreader and four smaller drops 5-6mm away from the corners.
This way you've already spreaded the thermal paste a little bit, but in our tests we
haven't experienced differences large enough to be noticed by the internal thermal
So however you do it, both methods should give you good results and proper contact
between CPU and NH-U12P SE1366.
R A S C O M Computerdistribution Ges.m.b.H.
Huttengasse 71-75, A - 1160 Wien/Vienna
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> Hi Noctua Support,
> In a few days I will build a new Core i7 based system. For CPU cooling I
> bought a NH-U12P SE1366 cooler. I selected your product after reviewing many
> websites and your seems to be the best in terms of quality and noiselevel.
> However, after reading the manual and the online FAQ I have a question about
> the thermal paste. In the manual it says to use a single drop (4-5 mm) of
> thermal paste on the center of the heat spreader, and then put the heatsink
> on the CPU. My question after reading was: How can I be sure that the
> thermal paste spreads evenly across the heatspreader and CPU? I mean, there
> is no way of checking this, unless you take it apart.
> I was looking for an answer in your online FAQ, but that confused me
> somewhat. In the FAQ there is a question like this:
> I can't spread the thermal compound by turning the cooler as described in
> the manual!
> Due to the new LGA mounting bars with screw threads that facilitate the
> installation process, there's little room to turn the cooler as described in
> step 4 of the supplied manual. There's nothing to worry about though, as you
> can still turn the cooler by a few millimetres in order to help the thermal
> compound spread. We've also made the compound slightly less viscous so that
> the contact pressure of mounting system is wholly sufficient to spread it.
> My confusion here is that the manual says nothing about turning the cooler
> (also the step number isn't right, it should be step 5 or 6).
> So the main question is: What is the best way of applying thermal paste and
> mounting the heatsink to the CPU, in order to get the best spreading of
> thermal paste and optimal cooling performance?
> I'm looking forward to your answer so I can start building my system!
> Thanks in advance,
> Kind Regards