Motorola heeft een succesje geboekt in de kopertechnologie.
Motorola researchers, in a technical breakthrough, have fabricated a multi-layer metal stack combining copper metal lines with a low-K porous film insulation, the company said Wednesday.
This is the first reported success in combining these materials in a multi-layer interconnect stack such as would be found on actual integrated circuits. The combination of copper, with its low resistivity and low-K dielectric materials, which sharply reduce parasitic capacitance, is regarded as necessary to the future of far-sub-micron integrated circuits.
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