Mounting the memory chips
The Sapphire machine mentioned on the previous page can only put small parts onto the PCB. The Topaz machine is used to put the bigger parts onto the PCB. This machine is also a Philips-product like the Sapphire. The basic construction of both machines is very similar. The difference between them is that the Topaz can handle parts accurate to 32 millimeter (memory chips) due to a intelligent system which is called: on-the-fly vision alignment. With the help of small movable cameras this machine can handle smaller parts but the Sapphire is preferred to handle this task. The latter one does about 24.500 units per hour while the Topaz does 'only' a mere 14.000 in the same time.




When every part is in the right place the moment of baking the chip starts. The chips are put into the oven. Dane-Elec prefers to call it: computerized thermal processing system. The oven has to do the following; vaporize a part of the paste, melt another part of it and finally harden a part of the paste again on the PCB. In the end all the placed parts have to be stuck on their mounted spot. Very high temperatures are needed in this process. Overclockers can tell you that only a few processors will survive temperatures higher than 100 degrees Celsius, but the memory chips have to withstand temperatures almost three times higher in the oven.




The manufacturer of the memory chips develops a model in cooperation with the supplier of the welding paste. This model is designed in such a way that the chips can be welded in the oven without breaking down. The chips can withstand temperatures of over 270 degrees Celsius two times in a row. The reason for this is that double sided memory has to pass the production line twice.

When the modules leave the oven they are put into a feeder on the other end of the production line. Lamps indicate if there is still place available otherwise it indicates it's time to empty the feeder. The distance the PCB totally covers is 20 meters from on end to the other end of the feeder. The finished modules are immediately sterilizedand labeled.


Every piece of equipment is kept very clean

The memory chips a packed on large rolls

...and are individually packaged as well

For every type of module a different program has to be loaded
When every part is in the right place the moment of baking the chip starts. The chips are put into the oven. Dane-Elec prefers to call it: computerized thermal processing system. The oven has to do the following; vaporize a part of the paste, melt another part of it and finally harden a part of the paste again on the PCB. In the end all the placed parts have to be stuck on their mounted spot. Very high temperatures are needed in this process. Overclockers can tell you that only a few processors will survive temperatures higher than 100 degrees Celsius, but the memory chips have to withstand temperatures almost three times higher in the oven.

The oven

To use the entire width of the oven, the computer can move the conveyor belt

Fingerguards, but probably not your average 80 x 80 fan

For people who do not understand that things in an oven get hot
The manufacturer of the memory chips develops a model in cooperation with the supplier of the welding paste. This model is designed in such a way that the chips can be welded in the oven without breaking down. The chips can withstand temperatures of over 270 degrees Celsius two times in a row. The reason for this is that double sided memory has to pass the production line twice.

Temperature configuration of the oven
When the modules leave the oven they are put into a feeder on the other end of the production line. Lamps indicate if there is still place available otherwise it indicates it's time to empty the feeder. The distance the PCB totally covers is 20 meters from on end to the other end of the feeder. The finished modules are immediately sterilizedand labeled.

Endstation
Next page (CompactFlash - 5/7)